congatec launches 5 new COM-HPC Server Size D modules with Intel Xeon D-2700 processors


congatec extends its range of on-module servers based on the Intel Xeon D-2700 processor by launching 5 new modules in the compact class COM-HPC Server Size D



congatec expands its range of on-module servers based on the Intel Xeon D-2700 processor by launching 5 new modules in the compact COM-HPC Server Size D class.

SAN DIEGO/CA, CALIFORNIA, USA, June 30, 2022 / — congatec – a leading provider of edge-to-edge embedded computing technology – expands its portfolio of on-module servers based on the Intel Xeon D-2700 processor by launching five new modules in the compact (160x160mm) COM-HPC Server Size D performance class. outside. It also takes Intel Xeon D-2700 processors, with up to 20 cores, even deeper into the realm of real-time demanding mixed-critical applications. Compared to the larger COM-HPC Server Size E modules (200 x 160 mm) already available, the number of supported DRAM modules is halved from 8 bars to 4 bars. Nevertheless, an impressive 512 GB of DDR4 2933 MT/s RAM is provided. The advantage of limiting RAM is that the modules take up less space, which reduces the required footprint by 20% compared to the E size. The target applications for the new COM-HPC modules based on the Intel Xeon D processor -2700 are deeply integrated, space-constrained Edge Server deployments with high data throughput but less memory intensive workloads. They are typically found in IIoT networked real-time environments of smart factories and critical infrastructure.

“Our current launch can be described as ‘less is more’: mixed mission-critical Edge Server applications don’t have to handle RAM-intensive server workloads. Instead, they have to host multiple real-time applications side by side and therefore require as many cores as possible. They also have to meet the demands of industrial communications with many small message packets that need to be processed in real time. Again, memory is not as critical as the database-based web servers that are used by thousands of people in parallel.It is true that customers can use COM-HPC Server Size E modules with only 4 bars of RAM.However, space saving is also very important to them, which is why we now also offer the Intel Xeon processor in COM-HPC Server Size D,” says Martin Danzer, Head of Product Management. products at congatec.

Regardless of the different Server-on-Module specifications, all congatec COM-HPC server modules with Intel Xeon (formerly Ice Lake D) processors in size E and size D as well as the COM Express Type 7 form factor accelerate the next generation of true open-ended microserver workloads in harsh environments and wide temperature ranges. Enhancements include up to 20 cores, up to 1TB of RAM, double throughput per PCIe lane at Gen 4 speeds, as well as up to 100GbE connectivity and TCC/TSN support. Target applications range from industrial workload consolidation servers for automation, robotics and medical imaging to outdoor servers for utilities and critical infrastructure – such as smart grids for oil, gas and electricity as well as rail and communications networks – and also include vision-enabled applications such as autonomous vehicles and video infrastructure for safety and security.

In addition to the huge bandwidth and performance improvements, congatec’s server-on-module families significantly extend the life cycle of next-generation rugged state-of-the-art server designs over mainstream servers, as long-term availability of up to up to ten years is part of the roadmap. The module families additionally convince with a comprehensive set of server-level features: for mission-critical designs, they offer powerful hardware security features, including Intel Boot Guard, Intel Total Memory Encryption – Multi-Tenant (Intel TME-MT) and Intel Software Guard Extensions (Intel SGX). Artificial intelligence applications benefit from built-in hardware acceleration, including AVX-512 and VNNI. For enhanced RAS capabilities, the processor modules incorporate Intel Resource Director Technology (Intel RDT) and support remote hardware management features.

The feature set in detail
The five new conga-HPC/sILH server modules with Intel Xeon D-2700 series processors extend congatec’s existing COM-HPC Server Size D product line with Intel Xeon D-1700 processors. Both series of processors are based on the generation formerly named Ice Lake. The current launch doubles the number of available cores of this compact high-performance 160 x 160 mm server-on-module from 10 to 20. Memory support is expanded from three to four channels of DDR4 RAM with up to 512 GB at 2,933 MT/s. For connecting a wide range of dedicated controllers, compute accelerator cards and NVMe storage media in rugged Edge Server installations, they feature 32 PCIe Gen 4 lanes in addition to 16 PCIe Gen 3 lanes. real-time networking, there’s 1x 2.5 GbE with TSN and TCC support in addition to 100 GB extended Ethernet bandwidth in various configurations including 1x 100 GbE, 2x 50 GbE, 4x 25 GbE as well as several other configurations via KR or SFI interfaces. Other interfaces include 4x USB 3.1 and 4x USB 2.0. For non-volatile storage, the modules optionally support an integrated eMMC 5.1 with a capacity of up to 128 GB as well as 2 SATA III interfaces.

The new out-of-the-box COM-HPC server-on-modules ship with full board support packages for Windows, Linux, and VxWorks. For workload consolidation, support for real-time virtual machines is available through congatec’s comprehensive support for Real-Time Systems’ RTS Hypervisor implementations. congatec also offers perfectly matched cooling solutions, ranging from powerful active cooling with heat pipe adapter to fully passive cooling solutions for better mechanical resistance to vibration and shock.

For more information on the conga-HPC/sILH COM-HPC Server Size D Server-on-Module, please visit

More information on the new Intel Xeon D-2700 processors can be found on the main homepage:

Farhad Charifi
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